Cart (Loading....) | Create Account
Close category search window
 

Pulsed laser deposition of Cu:Al2O3 nanocrystal thin films with high third-order optical susceptibility

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $31
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

7 Author(s)
Ballesteros, J.M. ; Instituto de Optica, C.S.I.C., Serrano 121, 28006 Madrid, Spain ; Serna, R. ; Solı s, J. ; Afonso, C.N.
more authors

Your organization might have access to this article on the publisher's site. To check, click on this link:http://dx.doi.org/+10.1063/1.120117 

Nanocomposite films comprising metal Cu nanocrystals embedded in an Al2O3 matrix were deposited by alternating pulsed laser ablation from metallic Cu and ceramic Al2O3 targets. The films were grown in vacuum on glass substrates held at room temperature. The as-grown films contain 4 nm Cu nanocrystals in an amorphous Al2O3 matrix, with a total thickness of 190 nm. The films show a substantial third-order susceptibility with an electronic nonlinear refractive index of (2.93±1.08)∙10-10cm2 W-1 and a nonlinear saturation of -(2.34±0.18)∙10-5cm W-1. © 1997 American Institute of Physics.

Published in:

Applied Physics Letters  (Volume:71 ,  Issue: 17 )

Date of Publication:

Oct 1997

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.