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Tutorial: temperature as an input to microelectronics-reliability models

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1 Author(s)
P. Lall ; Motorola Inc., Plantation, FL, USA

This tutorial discusses various modeling methodologies for temperature acceleration of microelectronic-device failures; there are situations in which some methodologies give-misleading results. The aim is to raise the level of understanding of the impact of temperature on reliability and to define the objectives of physics-based temperature modeling. There are alternatives to both the Arrhenius relation and the MilHdbk-217 approach to reliability. In Japan, Taiwan, Singapore, and Malaysia, a physics-of-failure approach is used by most companies. Philips in the Netherlands and the CADMP Alliance in the USA have developed methods and software to conduct physics-based reliability assessments

Published in:

IEEE Transactions on Reliability  (Volume:45 ,  Issue: 1 )