Thin (80–200 Å) silicon dioxide (SiO2) films have been deposited by low pressure rapid thermal chemical vapor deposition (RTCVD), using silane (SiH4) and nitrous oxide (N2O) as the reactive gases for the first time. A deposition rate of 55 Å/min has been achieved at 800 °C with a SiH4/N2O flow rate ratio of 2%. Auger electron spectroscopy (AES) and Rutherford back scattering spectroscopy (RBS) have shown a uniform and stoichiometric composition throughout the deposited oxide films. Electrical characterization of the films have shown an average catastrophic breakdown field of 13 MV/cm and a midgap interface trap density (Dit) of equal to or less than 5×1010 eV-1 cm-2. The results suggest that the deposited RTCVD SiO2 films using SiH4‐N2O gas system may have the potential to be used as the gate dielectric in future low‐temperature metal oxide semiconductor (MOS) device processes for ultralarge scale integration (ULSI).