Skip to Main Content
Your organization might have access to this article on the publisher's site. To check, click on this link:http://dx.doi.org/+10.1063/1.107323
We describe a new technique for measuring the thickness and optical constants of dielectric, semiconducting, and thin metal films. Beam profile reflectometry provides excellent precision for films as thin as 30 Å and as thick as 20 000 Å. The technique is also capable of simultaneous 2 and 3 parameter measurements and it performs all measurements with a submicron spot size.