Cart (Loading....) | Create Account
Close category search window

Analysis of 3D microwave cavities using hierarchal vector finite elements

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $31
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)

A set of hierarchal vector finite elements is used to predict the resonances of 3D microwave cavities. The elements are higher-order versions of an established curvilinear brick element. Like this element, they impose only tangential continuity on the field, and are therefore suitable for modelling abrupt material interfaces and sharp corners. They are also of mixed polynomial order to avoid spurious modes. Each element in the set is formed from lower elements by adding basis functions of higher polynomial order; the set is therefore hierarchal, and different element orders can be used side by side in the same mesh. The elements are applied to a number of resonance problems with known solutions: a cube, an empty cylindrical cavity, a length of ridge waveguide, a dielectric-loaded rectangular cavity and an enclosed microstrip patch

Published in:

Microwaves, Antennas and Propagation, IEE Proceedings  (Volume:142 ,  Issue: 5 )

Date of Publication:

Oct 1995

Need Help?

IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.