By Topic

Effect of temperature and stress on plastic deformation in monocrystalline silicon induced by scratching

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $31
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Zarudi, I. ; School of Aerospace, Mechanical and Mechatronic Engineering, the University of Sydney, NSW 2006, Australia ; Nguyen, T. ; Zhang, L.C.

Your organization might have access to this article on the publisher's site. To check, click on this link:http://dx.doi.org/+10.1063/1.1847692 

Dry air, coolant, and liquid nitrogen were applied, respectively, to study the effect of temperature and stress on plastic deformation in scratching monocrystalline silicon. Phases generated in surface deformation were characterized by means of the transmission electron microscopy. It was shown that the size of the amorphous transformation zone and the depth of slip penetration in sample subsurface were mainly dependent on the stress field applied. The influence of the temperature variation to -196 °C was surprisingly small and the low temperature did not suppress the phase transformation and dislocation activity.

Published in:

Applied Physics Letters  (Volume:86 ,  Issue: 1 )