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High-power-density spot cooling using bulk thermoelectrics

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3 Author(s)
Yan Zhang ; Electrical Engineering Departmemt of University of California, Santa Cruz, California 9405 ; Shakouri, Ali ; Gehong Zeng

Your organization might have access to this article on the publisher's site. To check, click on this link:http://dx.doi.org/+10.1063/1.1800290 

We demonstrate a three-dimensional (3D) bulk silicon microcooler, which has the advantages of high cooling power densities and is less dependent on thermoelectric element’s thickness as compared with the same device with one-dimensional (1D) geometry. We measured a maximum cooling of 1.2 °C for a 40×40 μm2 area bulk silicon microcooler device, which is equivalent to an estimated cooling power density of 580 W/cm2. In this unique geometry, both current and heat spreading in 3D allows the maximum cooling temperature to exceed the conventional 1D thermoelectric model’s theoretical limit 0.5 ZTc2.

Published in:

Applied Physics Letters  (Volume:85 ,  Issue: 14 )