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A methodology for the heterogeneous integration of epitaxial GaAs wafers with fully processed standard bipolar complementary metal-oxide-semiconductor Si wafers is presented. The complete low-temperature wafer bonding process flow, including procedures for the Si wafer planarization and GaAs substrate removal, has been developed and evaluated. The implementation of an in-plane optical link, consisting of an edge-emitting laser diode, a waveguide and a photodiode, is demonstrated. © 2002 American Institute of Physics.