Bulk, single-crystal ZnO was etched in Cl2/Ar and CH4/H2/Ar inductively coupled plasmas as a function of ion impact energy. For CH4/H2/Ar, the etch rate (R) increases with ion energy (E) as predicted from a model of ion enhanced sputtering by a collision–cascade process, R∝(E0.5-ETH0.5), where the threshold energy, ETH, is ∼96 eV. Band edge photoluminescence intensity decreases with incident ion energy in both chemistries, with a 70% decrease even for low energies (∼116 eV). Surface roughness is also a function of ion energy with a minimum at ∼250 eV, where Auger electron spectroscopy shows there is no measurable change in near-surface stoichiometry from that of unetched control samples. © 2002 American Institute of Physics.
Published in:
Applied Physics Letters
(Volume:81
,
Issue:
19
)
Date of Publication:
Nov 2002
- Page(s):
-
3546
-
3548
- ISSN :
-
0003-6951
- Digital Object Identifier :
-
10.1063/1.1519095
- Date of Current Version :
-
18 June 2009
- Issue Date :
-
Nov 2002