By Topic

Possible solution of the grain-boundary problem for applications of high-Tc superconductors

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

The purchase and pricing options are temporarily unavailable. Please try again later.
7 Author(s)
Hammerl, G. ; Experimentalphysik VI, Center for Electronic Correlations and Magnetism, Institute of Physics, Augsburg University, D-86135 Augsburg, Germany ; Herrnberger, A. ; Schmehl, A. ; Weber, A.
more authors

Your organization might have access to this article on the publisher's site. To check, click on this link: 

It is shown that the critical current density of high-Tc wires can be greatly enhanced by using a three-fold approach, which consists of grain alignment, doping, and optimization of the grain architecture. According to model calculations, current densities of 4×106A/cm2 can be achieved for an average grain alignment of 10° at 77 K. Based on this approach, a road to competitive high-Tc cables is proposed. © 2002 American Institute of Physics.

Published in:

Applied Physics Letters  (Volume:81 ,  Issue: 17 )