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Browse Journals & Magazines > Components, Packaging, and Ma ...> Volume:19 Issue:1 Help

Experimental characterization of transmission lines in thin-film multichip modules

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4 Author(s)
Lipa, S. ; Dept. of Electr. & Comput. Eng., North Carolina State Univ., Raleigh, NC, USA ; Steer, M.B. ; Cangellaris, A.C. ; Franzon, P.D.

Signal propagation on transmission lines fabricated in thin polyimide films on silicon substrates is investigated. Series resistive and shunt conductive losses are separated and it is shown that the effective dielectric loss is much higher than that expected from bulk material properties

Published in:
Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on  (Volume:19 ,  Issue: 1 )

Date of Publication: Mar 1996

Page(s):
122 - 126
ISSN :
1070-9886
INSPEC Accession Number:
5233172
Digital Object Identifier :
10.1109/95.486623
Product Type:
Journals & Magazines
Date of Current Version :
06 August 2002
Issue Date :
Mar 1996
Sponsored by :
IEEE Components, Packaging, and Manufacturing Technology Society

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