Cart (Loading....) | Create Account
Close category search window
 

The Lorentz forces on an electrically conducting sphere in an alternating magnetic field

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Sathuvalli, U.B. ; Dept. of Mech. Eng. & Mater. Sci., Rice Univ., Houston, TX, USA ; Bayazitoglu, Y.

A method to calculate the Lorentz force on an electrically conducting sphere placed in an arbitrary sinusoidally varying magnetic field is developed. The crux of this method lies in expressing the external magnetic held and the eddy current density in the sphere in terms of a “source function” of the current sources and a “skin depth dependent function”. The general formula for the Lorentz force is used to derive the special case of a sphere in an axisymmetric stack of circular current loops. Numerical results for this case are presented as a function of the stack geometry. Approximations of the skin depth functions for practical situations are presented. Finally, a procedure to determine the magnetic pressure distribution on the surface of a levitated liquid metal droplet is given

Published in:

Magnetics, IEEE Transactions on  (Volume:32 ,  Issue: 2 )

Date of Publication:

Mar 1996

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.