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Time-domain characterization and circuit modeling of a multilayer ceramic package

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3 Author(s)
Jyh-Ming Jong ; Dept. of Electr. & Comput. Eng., Oregon State Univ., Corvallis, OR, USA ; Janko, B. ; Tripathi, V.K.

The dynamic deconvolution (peeling algorithm) used in the past for single interconnects is extended to multiple-coupled interconnects and used to model high-speed electronic packages. A multilayer ceramic package (MLC) is used as vehicle to demonstrate the characterization and equivalent circuit modeling procedure based on single and multiport time-domain measurement

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Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on  (Volume:19 ,  Issue: 1 )