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A novel method of measuring microelectronic interconnect transmission line parameters and discontinuity equivalent electrical parameters using multiple reflections

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3 Author(s)
Abernethy, C.E. ; Dept. of Electr. & Comput. Eng., Arizona Univ., Tucson, AZ, USA ; Cangellaris, A.C. ; Prince, J.

This paper describes a novel technique which measures the electrical properties of transmission lines (such as microstrip) and extracts equivalent electrical parameters for discontinuities in transmission lines with remarkable precision using a modern network analyzer and newly developed de-embedding software. This technique has successfully measured the per-unit-length inductance (L'), resistance (R'), capacitance (C'), and dielectric loss conductance (G') of microstrip transmission lines made from solid copper and conductive polymer. These materials have been studied at frequencies up to 201 MHz, and higher frequencies are possible. Discontinuities, such as an opening in the ground plane under the microstrip, have also been characterized at frequencies up to 2400 MHz. Measurements of characteristic impedances and skin resistances made by this method are in agreement with theoretical models. Higher frequency measurements should be feasible using a higher frequency network analyzer

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Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on  (Volume:19 ,  Issue: 1 )