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SPICE-models for high-pincount board connectors

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3 Author(s)
Katzier, H. ; Public Commun. Networks, Siemens AG, Munich, Germany ; Reischl, R. ; Pagnin, P.

We present results obtained from a reliable SPICE model for SIPAC connectors. By means of typical measurement and simulation results, the reliability of the simulation model is demonstrated. All important electric characteristics of the connectors can be simulated by the SPICE-model, e.g., different time delays and characteristic impedances, transmission, and reflection characteristics and near-end and far-end crosstalk. There are no restrictions in the simulation concerning pin assignments. The comparison between simulation and measurement is very good up to a limit of f=3 GHz and a risetime of tr>35 ps

Published in:

Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on  (Volume:19 ,  Issue: 1 )

Date of Publication:

Feb 1996

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