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Etching characteristics of Si1-xGex alloy in ammoniac wet cleaning

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4 Author(s)
Koyama, Kazuhisa ; Microelectronics Research Laboratories, NEC Corporation, Miyazaki 4‐1‐1, Miyamae‐ku, Kawasaki 213, Japan ; Hiroi, Masayuki ; Tatsumi, T. ; Hirayama, Hiroyuki

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Etching characteristics of Si1-xGex alloys in ammoniac wet cleaning (RCA cleaning) were examined. The etching rate of Si1-xGex became larger with increasing Ge ratio (X). Temperature dependence of the etching rate was studied and the etching rate was large at high temperatures. However, no obvious difference was observed in the temperature dependence of Si1-xGex etching rate at different Ge ratio (X). A surface morhology degradation after RCA cleaning was observed at high Ge ratio (X). A stoichiometry change of Si1-xGex surface after RCA cleaning was observed by x‐ray photoelectron spectroscopy (XPS). The etching rate increase and the surface morphology degradation are thought to be due to the rapid etching of Ge atoms at the top surface layer.

Published in:

Applied Physics Letters  (Volume:57 ,  Issue: 21 )

Date of Publication:

Nov 1990

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