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Selective‐area electroless copper plating on polyimide employing laser patterning of a catalytic film

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3 Author(s)
Hirsch, T.J. ; Microelectronics and Computer Technology Corp., Austin, Texas 78727 ; Miracky, R.F. ; Lin, C.

Your organization might have access to this article on the publisher's site. To check, click on this link:http://dx.doi.org/+10.1063/1.103435 

A scanned, focused argon ion laser beam is used to locally heat a thin polymer/palladium film applied to a polyimide‐coated substrate, thereby reducing chemically bound palladium to palladium metal. The metallic palladium is resistant to a caustic etchant that removes the unirradiated film; the residual patterned palladium then acts as a catalyst for conventional electroless plating. As an alternate patterning method a laser may be used to selectively deposit the thin polymer film on the substrate from a surrounding liquid solution.

Published in:

Applied Physics Letters  (Volume:57 ,  Issue: 13 )

Date of Publication:

Sep 1990

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