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Laser projection patterned aluminum metallization for integrated circuit applications

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3 Author(s)
Blonder, G.E. ; AT&T Bell Laboratories, 600 Mountain Avenue, Murray Hill, New Jersey 07974 ; Higashi, G.S. ; Fleming, C.G.

Your organization might have access to this article on the publisher's site. To check, click on this link:http://dx.doi.org/+10.1063/1.98039 

We demonstrate the projection patterning of Al by laser activated metalorganic chemical vapor deposition. The laser activated deposition technique, which selects surface over gas phase reactions, is found to be compatible with standard photolithographic patterning and shows promise for simplifying integrated circuit fabrication. Two applications are highlighted: metal‐oxide field‐effect transistor metallization and Al interconnect fabrication.

Published in:
Applied Physics Letters  (Volume:50 ,  Issue: 12 )

Date of Publication: Mar 1987

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