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Intermetallic structure of laser reflowed Cu/Pb‐Sn solder joints

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3 Author(s)
Felton, L.E. ; Materials Engineering Department, Center for Manufacturing Productivity and Technology Transfer, Center for Integrated Electronics, Rensselaer Polytechnic Institute, Troy, New York 12180 ; Selsley, A.D. ; Ficalora, P.J.

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A Nd:YAG laser was used to reflow Cu/Pb‐Sn solder joints. The joints were reflowed with 60 W, 1 s laser pulse. The resulting intermetallic microstructure was examined with scanning electron microscopy, energy dispersive x‐ray analysis, and x‐ray diffraction. In addition to the intermetallic layer expected to form at the solder‐base metal interface, an intermetallic precipitate was found to form in the bulk solder. X‐ray diffraction data established the identity of the intermetallic as η‐Cu6Sn5.

Published in:

Applied Physics Letters  (Volume:54 ,  Issue: 21 )