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Sensitivity analysis of critical parameters in board test

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2 Author(s)
Tegethoff, M.M.V. ; Manuf. Test Div., Hewlett-Packard Co., Loveland, CO, USA ; Chen, T.W.

The authors analyze the main contributors to the quality and cost of complex boards. With manufacturing data from Hewlett-Packard boards, they use simulation models to derive the sensitivity of quality and cost to the solder defect rate, the functional defect rate, and test coverage. They also give a simple cost estimate of implementing IEEE 1149.1 boundary scan on ASICs. Their new yield model, which accounts for solder defect clustering, provides highly accurate yield predictions

Published in:

Design & Test of Computers, IEEE  (Volume:13 ,  Issue: 1 )