Cart (Loading....) | Create Account
Close category search window
 

Intracavity chirp compensation in a colliding pulse mode‐locked laser using thin‐film interferometers

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $31
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Heppner, J. ; Max–Planck‐Institut für Festkörperforschung, Heisenbergstr. 1, 7000 Stuttgart 80, Federal Republic of Germany ; Kuhl, J.

Your organization might have access to this article on the publisher's site. To check, click on this link:http://dx.doi.org/+10.1063/1.96144 

Dielectric multilayer mirrors designed as Gires–Tournois interferometers have been used in a colliding pulse mode‐locked dye laser to study the influence of intracavity group velocity dispersion on the pulse formation. Simple angle tuning of the interferometric mirrors which is equivalent to a change of the net cavity dispersion resulted in a shift of the laser wavelength between 627 and 614 nm. Within this range stable operation with pulse durations of 130 fs or less and average output powers between 30 and 80 mW was obtained. The shortest pulse of 80 fs duration was found at 626 nm.

Published in:

Applied Physics Letters  (Volume:47 ,  Issue: 5 )

Date of Publication:

Sep 1985

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.