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Enhanced plasma oxidation at low temperature using a thin solid electrolyte film

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6 Author(s)
Gourrier, S. ; Laboratoires d’Electronique et de Physique Appliquee, 3 avenue Descarted, 94450 Limeil Brevannes, FranceGroupe de Physique des Solides de l’Ecole Normale Superieure, Tour 23, 2 place Jussieu, 75005 Paris, FranceThomson CSF, Laboratoire Central de Recherche, Domaine de Corbeville, 91401 Orsay, France ; Dimitriou, P. ; Theeten, J.B. ; Perriere, J.
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Low‐temperature anodic oxidation in a ’’cold’’ plasma (multipole) of metals like Al or Ta through a thin calcia‐stabilized zirconia (CSZ) film is possible. Thick (≳300 nm) stoichiometric metal oxides are formed under the CSZ with high growth rates (20–30 nm/min). Anodization of bare metals under similar plasma conditions leads to very low oxidation rates (≪1 nm/min). The CSZ film, which acts as a selective oxygen filter, has thus greatly enchanced the oxidation rate. Low‐temperature (≪50 °C) plasma anodization of silicon (typical rates 2–3 nm/min) is also possible through a thin CSZ film.

Published in:
Applied Physics Letters  (Volume:38 ,  Issue: 1 )

Date of Publication: Jan 1981

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