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Self-aligned assembly technology for laser diode modules using stripe-type AuSn solder bump flip-chip bonding

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5 Author(s)
Sasaki, J. ; Functional Devices Res. Labs., NEC Corp., Kawasaki, Japan ; Honmou, H. ; Itoh, M. ; Uda, A.
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Alignment-free laser diode module assembly technology has been developed. The laser diode is self-aligned to a single-mode optical fiber (SMF) by using stripe-type AuSn solder bumps. Alignment error of ±1 μm has been achieved

Published in:
Lasers and Electro-Optics Society Annual Meeting, 1995. 8th Annual Meeting Conference Proceedings, Volume 1., IEEE  (Volume:1 )

Date of Conference: 30-31 Oct 1995

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