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3-D integration of MQW SEED detectors and modulators over active sub-micron CMOS circuits: Application to a 2KBit parallel photonic page buffer

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17 Author(s)

The efficacy of many system-designs based on free-space optical interconnects and smart-pixels, depends on the availability of a flexible, high-density, silicon-compatible, optoelectronic technology platform. To this end, we demonstrate the hybrid 3D integration of GaAs-AlGaAs 850nm multiple quantum well (MQW) detectors and modulators directly over active 0.8 μm silicon CMOS circuits. To test this technique, a self electro-optic effect device (SEED) input-light detector was flip-chip bonded over a transimpedance receiver circuit, whose output was fed to a simple transmitter circuit and then to another SEED device that served as an output-light modulator

Published in:

Lasers and Electro-Optics Society Annual Meeting, 1995. 8th Annual Meeting Conference Proceedings, Volume 1., IEEE  (Volume:1 )

Date of Conference:

30-31 Oct 1995