Skip to Main Content
Summary form only given. In-line and off-line metrology measurement and interpretation are a critical, but time consuming part of yield learning. Yield learning occurs during pilot line development and early volume manufacture. Networking analysis systems and whole wafer analysis tools can greatly reduce the cycle time associated with metrology during yield learning. Although in-line metrology tools have whole wafer capability, other tools such as scanning electron microscopes (equipped with energy dispersive spectroscopy: SEM/EDS) for defect review are recent developments. These SEM/EDS defect review tools (DRT) have coordinate locating stages and software capable of reading wafer defect maps from optical defect detection systems. In this paper, we discuss networked analysis systems and whole wafer tools for in/off-line analysis. The issues associated with data interpretation and management become greater with each new technology generation. We also discuss new network capabilities such as presorting electrical defects into similar types before physical characterization using "model yield learning".