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Transport and storage wafer carriers manufactured from different materials vary greatly in their initial cost. Many fabs have based their transport and storage carrier selection solely on this initial cost. However, total cost or cost of ownership depends on much more than the initial cost. This paper deals with the interrelationship between material properties, such as, particle generation, dimensional stability, outgassing, and temperature and how they affect cost of ownership. For example, particle generation and outgassing affect yield and the frequency of carrier and wafer cleaning steps. Dimensional accuracy and stability has an impact on equipment down time, wafer loss and particle generation. Temperature capabilities affect throughput and number of wafer transfers required. Dimensional stability and outgassing are also dependent on the temperature capabilities (thermal properties) of the transport wafer carrier material.