By Topic

Simultaneous control of multiple measures of nonuniformity using site models and monitor wafer control

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Saxena, S. ; Semicond. Process & Device Center, Texas Instrum. Inc., Dallas, TX, USA ; Mozumder, P.K. ; Taylor, Kelly J.

Present day semiconductor manufacturing processes are subject to tight specifications. High yields with tight process specifications require drive to target process control. As the size of the wafer in the semiconductor industry increases, nonuniformity across the wafer becomes a crucial yield limiting issue. Modeling nonuniformity in terms of the equipment settings permits calculation of recipes required to achieve the desired nonuniformity. However, models for single measures of nonuniformity, such as standard deviation, or range, do not capture all aspects of the nonuniformity and often do not model well in terms of the equipment settings. This paper describes the use of spatial models to simultaneously quantify multiple measures of nonuniformity, and a controller to keep the nonuniformities within specifications, Use of spatial models in conjunction with a monitor wafer controller (MWC) enables the simultaneous control of multiple nonuniformity measures. The paper presents the results of applying the MWC with spatial models to a plasma enhanced TEOS (PETEOS) deposition process on an Applied Materials Precision 5000 (AMT5000). The controller has been keeping the PETEOS process within specifications for over two years

Published in:

Semiconductor Manufacturing, IEEE Transactions on  (Volume:9 ,  Issue: 1 )