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Extraction of Via-Plate Capacitance of an Eccentric Via by an Integral Approximation Method

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5 Author(s)
Yaojiang Zhang ; Electromagn. Compatibility Lab., Missouri Univ. of Sci. & Technol., Rolla, MO ; Rimolo-Donadio, R. ; Jun Fan ; Schuster, C.
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An integral approximation method is proposed to extract the via-plate capacitance of an eccentric via in the via hole (anti-pad). An analytical formula is derived for the coaxial capacitance part, which is used as a benchmark to validate the integral approximation method. Furthermore, numerical simulations are also used to validate the method. It is shown that small eccentricity results in only a few percentage increase of the via-plate capacitance, which is helpful in specifying the manufacturing tolerance of via designs.

Published in:

Microwave and Wireless Components Letters, IEEE  (Volume:19 ,  Issue: 5 )

Date of Publication:

May 2009

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