Cart (Loading....) | Create Account
Close category search window

Homogeneous deformation of Au-based metallic glass micropillars in compression at elevated temperatures

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $31
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

4 Author(s)
Song, S.X. ; Department of Materials Science and Engineering, The University of Tennessee, Knoxville, Tennessee 37996, USA ; Lai, Y.H. ; Huang, J.C. ; Nieh, T.G.

Your organization might have access to this article on the publisher's site. To check, click on this link: 

We performed high-temperature microcompression tests on micron-sized pillar samples fabricated from Au49Ag5.5Pd2.3Cu26.9Si16.3 metallic glass near the glass transition temperature to investigate the homogeneous deformation behavior. Samples were invariably deformed uniformly. The strength was observed to decrease with increasing temperature and decreasing strain rate. Plastic flow behavior can be described by a shear transition zone model. The activation energy and the size of the basic flow unit were both deduced and compared favorably with the theory.

Published in:

Applied Physics Letters  (Volume:94 ,  Issue: 6 )

Date of Publication:

Feb 2009

Need Help?

IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.