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Theoretical analysis of texture effects on the surface morphological stability of metallic thin films

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3 Author(s)
Tomar, Vivek ; Department of Chemical Engineering, University of Massachusetts Amherst, Amherst, Massachusetts 01003-3110, USA ; Rauf Gungor, M. ; Maroudas, Dimitrios

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By using a nonlinear model of surface morphological evolution, linear stability analysis, and self-consistent dynamical simulations, we analyze the effects of surface crystallographic orientation of a metallic thin film on its surface morphological response to the simultaneous action of an electric field and mechanical stress. The analysis reveals improved surface morphological stability over a range of misorientation angles between the electric-field direction and “easy surface diffusion” directions; for 〈111〉-oriented surfaces in fcc metals, the surface morphological response is superior to that of 〈110〉- and 〈100〉-oriented surfaces. This finding provides an interpretation for the longer electromigration lifetime of {111}-textured metallic interconnects.

Published in:

Applied Physics Letters  (Volume:92 ,  Issue: 18 )