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Elastic deformation of silicon (001) wafers due to thin film stresses

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2 Author(s)
Janssen, G.C.A.M. ; Department of Materials Science and Engineering, TU Delft, Mekelweg 2, 2628 CD Delft, The Netherlands ; Pujada, B.R.

Your organization might have access to this article on the publisher's site. To check, click on this link:http://dx.doi.org/+10.1063/1.2787963 

Single crystal silicon is an elastically anisotropic material. The in-plane elastic modulus of Si (001) wafers varies 30% with the orientation with respect to the crystal axes. The line tension exerted on a Si (001) wafer by a uniform isotropic film under compressive stress leads to a nonuniform deformation, reflecting the elastic anisotropy of the silicon single crystal. For low line tensions, this deformation has a fourfold symmetry, with larger deformation in the less stiff directions. For larger line tensions, a saddle point deformation superimposed on a cylindrical symmetric deformation is observed.

Published in:

Applied Physics Letters  (Volume:91 ,  Issue: 12 )

Date of Publication:

Sep 2007

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