The authors report that for a-Si:H/c-Si heterostructure solar cell fabrication the presence of a boron-doped a-Si:H(p+) overlayer may cause H2 effusion from a (few nanometers) thin underlying intrinsic a-Si:H(i) film at moderate temperatures. This phenomenon is in agreement with losses in the electronic passivation quality of c-Si/a-Si:H(i)/a-Si:H(p+) structures occurring during low temperature (≤260 °C) postdeposition annealing. Consequently, it is argued that such passivation degradation is due to Si–H rupture in the a-Si:H(i) film, likely resulting in Si dangling bond defects, mediated by the presence of the doped layer.
Published in:
Applied Physics Letters
(Volume:91
,
Issue:
11
)
Date of Publication:
Sep 2007
- Page(s):
-
112109
-
112109-3
- ISSN :
-
0003-6951
- Digital Object Identifier :
-
10.1063/1.2783972
- Product Type:
-
Journals & Magazines
- Date of Current Version :
-
18 June 2009
- Issue Date :
-
Sep 2007