Cart (Loading....) | Create Account
Close category search window

Process optimization of organic thin-film transistor by ink-jet printing of DH4T on plastic

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $31
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

5 Author(s)
Song, Dae Ho ; Advanced Display Research Center, Kyung Hee University, Seoul 130-701, Korea ; Min Hee Choi ; Kim, June Young ; Jin Jang
more authors

Your organization might have access to this article on the publisher's site. To check, click on this link: 

The authors studied the organic thin-film transistor (OTFT) with a solution based dihexylquaterthiophene (DH4T) by ink-jet printing. The DH4T with 1.0 wt % solution in dichlorobenzene was used for printing of an active layer of OTFTs. In order to obtain a smooth and uniform film of DH4T, the substrate temperature was elevated to 60 °C and the printing was performed by an overlapping method. The OTFT on plastic exhibited an on/off current ratio of ∼107, a threshold voltage of -0.25 V, a gate voltage swing of 0.45 V/decade, and a field-effect mobility of 0.043 cm2/V s in the saturation region.

Published in:

Applied Physics Letters  (Volume:90 ,  Issue: 5 )

Date of Publication:

Jan 2007

Need Help?

IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.