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Structural and electrical characteristics of atomic layer deposited high κ HfO2 on GaN

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9 Author(s)
Chang, Y.C. ; Department of Materials Science and Engineering, National Tsing Hua University, Hsinchu 30012, Taiwan ; Chiu, H.C. ; Lee, Y.J. ; Huang, M.L.
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High κ HfO2 was deposited on n-type GaN (0001) using atomic layer deposition with Hf(NCH3C2H5)4 and H2O as the precursors. Excellent electrical properties of TiN/HfO2/GaN metal-oxide-semiconductor diode with the oxide thickness of 8.8 nm were obtained, in terms of low electrical leakage current density (∼10-6A/cm2 at VFB+1 V), well behaved capacitance-voltage (C-V) curves having a low interfacial density of states of 2×1011 cm-2 eV-1 at the midgap, and a high dielectric constant of 16.5. C-V curves with clear accumulation and depletion behaviors were shown, along with negligible frequency dispersion and hysteresis with sweeping biasing voltages. The structural properties studied by high-resolution transmission electron microscopy and x-ray reflectivity show an atomically smooth oxide/GaN interface, with an interfacial layer of GaON ∼1.8 nm thick, as probed using x-ray photoelectron spectroscopy.

Published in:
Applied Physics Letters  (Volume:90 ,  Issue: 23 )

Date of Publication: Jun 2007

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