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Bendable integrated circuits on plastic substrates by use of printed ribbons of single-crystalline silicon

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12 Author(s)
Jong-Hyun Ahn ; Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory and Beckman Institute for Advanced Science and Technology, Department of Chemistry, University of Illinois at Urbana-Champaign, Urbana, Illinois 61801 ; Hoon-Sik Kim ; Menard, Etienne ; Lee, Keon Jae
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This letter presents studies of several simple integrated circuits—n-channel metal-oxide semiconductor inverters, five-stage ring oscillators, and differential amplifiers—formed on thin, bendable plastic substrates with printed ribbons of ultrathin single-crystalline silicon as the semiconductor. The inverters exhibit gains as high as 2.5, the ring oscillators operate with oscillation frequencies between 8 and 9 MHz at low supply voltages (∼4 V), and the differential amplifiers show good performance and voltage gains of 1.3 for 500 mV input signals. The responses of these systems to bending-induced strains show that relatively moderate changes of individual transistors can be significant for the operation of circuits that incorporate many transistors.

Published in:

Applied Physics Letters  (Volume:90 ,  Issue: 21 )

Date of Publication:

May 2007

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