Cart (Loading....) | Create Account
Close category search window
 

Bendable integrated circuits on plastic substrates by use of printed ribbons of single-crystalline silicon

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $31
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

12 Author(s)
Jong-Hyun Ahn ; Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory and Beckman Institute for Advanced Science and Technology, Department of Chemistry, University of Illinois at Urbana-Champaign, Urbana, Illinois 61801 ; Hoon-Sik Kim ; Menard, Etienne ; Lee, Keon Jae
more authors

Your organization might have access to this article on the publisher's site. To check, click on this link:http://dx.doi.org/+10.1063/1.2742294 

This letter presents studies of several simple integrated circuits—n-channel metal-oxide semiconductor inverters, five-stage ring oscillators, and differential amplifiers—formed on thin, bendable plastic substrates with printed ribbons of ultrathin single-crystalline silicon as the semiconductor. The inverters exhibit gains as high as 2.5, the ring oscillators operate with oscillation frequencies between 8 and 9 MHz at low supply voltages (∼4 V), and the differential amplifiers show good performance and voltage gains of 1.3 for 500 mV input signals. The responses of these systems to bending-induced strains show that relatively moderate changes of individual transistors can be significant for the operation of circuits that incorporate many transistors.

Published in:

Applied Physics Letters  (Volume:90 ,  Issue: 21 )

Date of Publication:

May 2007

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.