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Browse Journals & Magazines > Applied Physics Letters ...> Volume:89 Issue:22 Help

Effect of entropy production on microstructure change in eutectic SnPb flip chip solder joints by thermomigration

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4 Author(s)
Ouyang, Fan-Yi ; Department of Materials Science and Engineering, University of California, Los Angeles, Los Angeles, California 90095-1595 ; Tu, K.N. ; Yi-Shao Lai ; Gusak, Andriy M.

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Thermomigration in flip chip solder joints of eutectic SnPb has been studied at an ambient temperature of 100 °C. Redistribution of Sn and Pb occurs with Pb moving to the cold end. A stepwise concentration profile is observed. Significantly, the lamellar microstructure becomes much finer after thermomigration. Since the lamellar interface is disordered and is a fast path of diffusion, it indicates a high rate of entropy production in the thermomigration, in agreement with Onsager’s principle of irreversible processes. The effect of entropy production on microstructure change is shown here. The molar heat of transport of Pb has been calculated to be -25.3 kJ/mole.

Published in:
Applied Physics Letters  (Volume:89 ,  Issue: 22 )

Date of Publication: Nov 2006

Page(s):
221906 - 221906-3
ISSN :
0003-6951
Digital Object Identifier :
10.1063/1.2385205
Product Type:
Journals & Magazines
Date of Current Version :
18 June 2009
Issue Date :
Nov 2006

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