Cart (Loading....) | Create Account
Close category search window
 

Patterning ∼20 nm half-pitch lines on silicon using a self-assembled organosilicate etch mask

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $31
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

8 Author(s)
Sundstrom, Linnea ; IBM Research Division, Almaden Research Center, 650 Harry Road, San Jose, California 95120 ; Krupp, Leslie ; Delenia, Eugene ; Rettner, C.
more authors

Your organization might have access to this article on the publisher's site. To check, click on this link:http://dx.doi.org/+10.1063/1.2205178 

Lines of ∼20 nm half-pitch were generated on silicon surface using a self-assembled organosilicate nanostructure. A mixture of a poly(styrene-b-ethylene oxide) (PS-b-PEO) with an organosilicate precursor that is selectively miscible with PEO was used to create lamellar phase whose orientation was controlled perpendicular to the surface by tuning the surface energy of substrates. Thermal cross-linking of the organosilicate precursor followed by thermal decomposition of the PS-b-PEO leaves a robust organosilicate line pattern of sublithographic length scales on the surface. Line patterns on silicon substrate were created by transferring this self-assembled pattern into the underlying silicon substrate using anisotropic plasma etching.

Published in:

Applied Physics Letters  (Volume:88 ,  Issue: 24 )

Date of Publication:

Jun 2006

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.