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A method of the interfacial adhesion measurements utilizing the generation and monitoring of high-power surface acoustic wave has been reported. High-power surface acoustic wave was generated by surface optical breakdown in a transparent dielectric substrate. Modification of the tension-to-shear stresses ratio with film thickness was demonstrated. The normal stress generated at the interface is about one order of magnitude higher compared to those reported in laser spallation experiments; therefore stronger interfaces can be tested with less damage to the substrate.