Close category search window
 

Thin-film adhesion measurement using laser-generated high-power surface acoustic wave

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $31
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

6 Author(s)
Kireev, V. ; Center for Engineering Science Advanced Research, Computer Science and Mathematics Division, Oak Ridge National Laboratory, Oak Ridge, Tennessee 37831 ; Liu, Y. ; Braiman, Y. ; Radhakrishnan, B.
more authors

Your organization might have access to this article on the publisher's site. To check, click on this link:http://dx.doi.org/+10.1063/1.2203205 

A method of the interfacial adhesion measurements utilizing the generation and monitoring of high-power surface acoustic wave has been reported. High-power surface acoustic wave was generated by surface optical breakdown in a transparent dielectric substrate. Modification of the tension-to-shear stresses ratio with film thickness was demonstrated. The normal stress generated at the interface is about one order of magnitude higher compared to those reported in laser spallation experiments; therefore stronger interfaces can be tested with less damage to the substrate.

Published in:
Applied Physics Letters  (Volume:88 ,  Issue: 19 )

Date of Publication: May 2006

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2013 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.