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Effect of Al-trace dimension on Joule heating and current crowding in flip-chip solder joints under accelerated electromigration

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3 Author(s)
Liang, S.W. ; Department of Material Science and Engineering, National Chiao Tung University, Hsin-chu, Taiwan 30050, Republic of China ; Chang, Y.W. ; Chen, Chih

Your organization might have access to this article on the publisher's site. To check, click on this link:http://dx.doi.org/+10.1063/1.2198809 

Three-dimensional thermoelectrical simulation was conducted to investigate the influence of Al-trace dimension on Joule heating and current crowding in flip-chip solder joints. It is found that the dimension of the Al-trace effects significantly on the Joule heating, and thus directly determines the mean time to failure (MTTF). Simulated at a stressing current of 0.6 A at 70 °C, we estimate that the MTTF of the joints with Al traces in 100 μm width was 6.1 times longer than that of joints with Al traces in 34 μm width. Lower current crowding effect and reduced hot-spot temperature are responsible for the improved MTTF.

Published in:

Applied Physics Letters  (Volume:88 ,  Issue: 17 )

Date of Publication:

Apr 2006

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