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Droplet-based photoresist deposition

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1 Author(s)
Demirci, U. ; Department of Electrical Engineering, E. L. Ginzton Laboratory, Stanford University, California 94305

Your organization might have access to this article on the publisher's site. To check, click on this link:http://dx.doi.org/+10.1063/1.2191087 

Photoresist droplets are ejected onto a wafer surface by an acoustic two-dimensional micromachined ejector array. The spread of single droplets on a silicon wafer surface at varying droplet speeds is studied. Series of photoresist droplets are printed periodically drop on demand on a silicon wafer surface and profiles of a single droplet and two droplets overlapping with varying distances of 25 and 1 μm on a silicon wafer are demonstrated. Moreover, 3.4 μm thick spinless full coverage of a 4 in. wafer with photoresist is demonstrated which indicates a potential for coating wafers in less than a few seconds.

Published in:

Applied Physics Letters  (Volume:88 ,  Issue: 14 )