Cart (Loading....) | Create Account
Close category search window
 

Generating random surfaces with desired autocorrelation length

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $31
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Zhang, Yilei ; Department of Mechanical Engineering, Iowa State University, Ames, Iowa 50011 ; Sundararajan, Sriram

Your organization might have access to this article on the publisher's site. To check, click on this link:http://dx.doi.org/+10.1063/1.2191882 

A versatile surface processing method based on electrostatic deposition of particles and subsequent dry etching is shown to be able to tailor the autocorrelation length of a random surface by varying particle size and coverage. An explicit relation between final autocorrelation length, surface coverage of the particles, particle size, and etch depth is built. The autocorrelation length of the final surface closely follows a power law decay with particle coverage, the most significant processing parameter. Experimental results on silicon substrates agree reasonably well with model predictions.

Published in:

Applied Physics Letters  (Volume:88 ,  Issue: 14 )

Date of Publication:

Apr 2006

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.