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Effect of current crowding on void propagation at the interface between intermetallic compound and solder in flip chip solder joints

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6 Author(s)
Zhang, Lingyun ; Department of Materials Science and Engineering, University of California, Los Angeles, California 90095-1595 ; Ou, Shengquan ; Huang, Joanne ; Tu, K.N.
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We propose a kinetic model to describe a pancake-type void propagation in flip chip solder joints due to current crowding in electromigration. The divergence of the vacancy fluxes at the interface between the solder and Cu6Sn5 leads to void formation and propagation along the interface between them. Based on the continuity condition, the void growth velocity is calculated. The theoretical calculations are in reasonable agreement with the experimental results.

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Applied Physics Letters  (Volume:88 ,  Issue: 1 )