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Performance characterization of pressure sensitive adhesive thermal interface materials

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2 Author(s)
Chu, H. ; Cisco Syst., Inc., San Jose, CA ; Selvakumar, A.

An issue often raised by engineers regarding thermal interface materials (TIM) is that vendor data do not match the results obtained from actual applications. Typical reasons for these issues may be vendor variations in testing, such as variances in test procedure and setup. This study compares vendor data from various vendors with results obtained from both realistic and ideal test conditions under consistent test method and uniform test conditions, in order to eliminate any inconsistencies in testing. This current work examines the performance of thermal pressure sensitive adhesive (PSA) TIMs, and compares the thermal performance of various materials from several vendors. For comparison to vendor data, testing is performed for flat and non-flat surfaces to examine the differences under ideal condition to that of more realistic in actual applications. The test process, results and observations are discussed.

Published in:

Semiconductor Thermal Measurement and Management Symposium, 2009. SEMI-THERM 2009. 25th Annual IEEE

Date of Conference:

15-19 March 2009