Referenced Items are not available for this document.
Thermal conduction into a printed circuit board is often an important part of the critical heat transfer path in electronic devices. Capturing the effect of the heterogeneous and anisotropic nature of the printed circuit board's copper distribution on thermal resistance distribution is crucial for simulations of conduction dominated cooling solutions..
Published in:
Semiconductor Thermal Measurement and Management Symposium, 2009. SEMI-THERM 2009. 25th Annual IEEE
Date of Conference: 15-19 March 2009
- Page(s):
- 76 - 86
- ISSN :
- 1065-2221
- E-ISBN :
- 978-1-4244-3665-1
- Print ISBN:
- 978-1-4244-3664-4
- INSPEC Accession Number:
- 10559955
- Conference Location :
- San Jose, CA
- Digital Object Identifier :
- 10.1109/STHERM.2009.4810746
- Product Type:
- Conference Publications
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