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Validation and sensitivity analysis of an image processing technique to derive thermal conductivity variation within a printed circuit board

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1 Author(s)
Blackmore, B. ; Mentor Graphics Corp., Dartmouth, MA

Thermal conduction into a printed circuit board is often an important part of the critical heat transfer path in electronic devices. Capturing the effect of the heterogeneous and anisotropic nature of the printed circuit board's copper distribution on thermal resistance distribution is crucial for simulations of conduction dominated cooling solutions..

Published in:

Semiconductor Thermal Measurement and Management Symposium, 2009. SEMI-THERM 2009. 25th Annual IEEE

Date of Conference:

15-19 March 2009

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