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In this paper, the feasibility of inkjet printing of circuit and microwave structures on paper-based substrates is investigated for the first time in the implementation of a complete low-cost wireless platform for sensors. First, the system-level design of the module including the amplifier characterization were carried out to ensure optimum performance of the sensor modules in the UHF bands used in RF identification communication. These results were then used to design two different antenna structures, which are printed on paper along with their respective circuit layouts using inket-printing technology. Different techniques were investigated for the assembly of circuit components on the silver printed layouts. Finally, wireless link measurements on the assembled prototypes verified the good performance on the wireless and sensing sides.