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Glass Microprobe with Embedded Silicon Vias for 3D Integration

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6 Author(s)
Chiung-Wen Lin ; Institute of NanoEng. and Microsystems, National Tsing Hua University, Taiwan ; Chih-Wei Chang ; Yu-Tao Lee ; Rongshun Chen
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This study presents a novel process to realize glass 2D-microprobe array. The through silicon vias (TSVs) can also be integrated with the glass 2D-microprobe using the micromachining process. The vertical integration of chips containing glass 2D-microprobe array is realized using these silicon TSVs. The 3D-microprobe array and the signal processing IC can be easily implemented after vertical assembly of 2D-microprobe chips using bonding. In application, the 2D glass microprobe is fabricated with a low impedance of 439 kOmega at 1 kHz; and the neural recording experiment has also been successfully performed on a rat.

Published in:

Micro Electro Mechanical Systems, 2009. MEMS 2009. IEEE 22nd International Conference on

Date of Conference:

25-29 Jan. 2009