Glass Microprobe with Embedded Silicon Vias for 3D Integration

This study presents a novel process to realize glass 2D-microprobe array. The through silicon vias (TSVs) can also be integrated with the glass 2D-microprobe using the micromachining process. The vertical integration of chips containing glass 2D-microprobe array is realized using these silicon TSVs. The 3D-microprobe array and the signal processing IC can be easily implemented after vertical assembly of 2D-microprobe chips using bonding. In application, the 2D glass microprobe is fabricated with a low impedance of 439 kOmega at 1 kHz; and the neural recording experiment has also been successfully performed on a rat.