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A Finite-Element-Based Solder-Joint Fatigue-Life Prediction Methodology for Sn–Ag–Cu Ball-Grid-Array Packages

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2 Author(s)
Walter Dauksher ; Avago Technol., Fort Collins, CO ; John Lau

A finite-element-based modeling methodology for predicting the part-on-board fatigue life of lead-free solder balls is presented. The computationally efficient methodology is calibrated with a wide assortment of published test data.

Published in:

IEEE Transactions on Device and Materials Reliability  (Volume:9 ,  Issue: 2 )