By Topic

A Thermal–Hydraulic Comparison of Liquid Microchannel and Impinging Liquid Jet Array Heat Sinks for High-Power Electronics Cooling

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

1 Author(s)
Anthony J. Robinson ; Dept. of Mech. & Manuf. Eng., Trinity Coll. Dublin, Dublin, Ireland

In this paper, two single-phase liquid cooling strategies for electronics thermal management are compared and contrasted; impinging jet arrays and laminar flow in microchannels. The comparison is posed for a situation in which an electronic device must dissipate 250 W/cm2 while being maintained at a temperature of 85degC. The calculations indicate that both the impinging jet and microchannel heat sinks can provide the necessary cooling with less than 0.1 W of pumping power. Microchannels achieve this heat transfer target with such low pumping power by the relatively high pressure drop being offset by a low volumetric flow rate. In contrast, impinging jet heat sinks require a lower pressure drop and higher volumetric flow rate. From a practical point of view, lower operating pressure and larger mass flow rates are desirable characteristics, since they will be less prone to leakage and will provide better temperature uniformity across the heated component.

Published in:

IEEE Transactions on Components and Packaging Technologies  (Volume:32 ,  Issue: 2 )