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Reliability Analysis of Thermal Conduction of Slow-Wave Structures Assembled With Different Methods

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4 Author(s)
Yong Han ; Key Lab. of High Power Microwave Sources & Technol., Chinese Acad. of Sci., Beijing ; Yan-Wen Liu ; Yao-Gen Ding ; Pu-Kun Liu

This paper presents the study on the thermal conduction reliability of the helix traveling-wave-tube (TWT) slow-wave structure (SWS), considering two affecting factors, such as the outside thermal condition and the manufacturing process. ANSYS has been used to analyze the variation of the heat dissipation capability of the SWS under different thermal conditions. Several experimental tests have been implemented to study the effect of the manufacturing process on the thermal conduction of the SWS. The conclusions obtained are expected be a valuable aid to the manufacture of helix TWT.

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Device and Materials Reliability, IEEE Transactions on  (Volume:9 ,  Issue: 2 )